| 摘要 |
A process is provided for producing an insulating system, comprising at least a vacuum insulating panel ( 20; 30 ) in a matrix of homogeneous polymeric foam ( 602; 707 ), inside an interspace ( 101; 703 ) of a device which must subsequently be subjected, at least at the interspace, to a temperature higher than 100° C., without damaging this system and without causing it to lose its original insulating properties, by providing a flexible protection system of cardboard.
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