发明名称 |
FORM-IN-PLACE EMI GASKETS |
摘要 |
<p>A form in place conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive outerlayer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.</p> |
申请公布号 |
CA2129073(C) |
申请公布日期 |
2007.06.05 |
申请号 |
CA19942129073 |
申请日期 |
1994.07.28 |
申请人 |
CHOMERICS, INC. |
发明人 |
KALINOSKI, JOHN P.;BUNYAN, MICHAEL H. |
分类号 |
B65D81/30;H05K9/00;B65D53/06;F16J15/06;F16J15/14;H01B1/20;H01Q17/00 |
主分类号 |
B65D81/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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