| 摘要 |
An adjustable height wafer box for the transportation of coin-stacked semiconductor wafers is disclosed. The adjustable height wafer box comprises a base plate, a cover plate, a plurality of ring insert plates and elastomer bumpers. The ring insert plates are stacked so as to successively engage one another, as well as engaging the base plate and the cover plate. The elastomer bumpers are engaged between successive ring insert plates and extend inwardly into the wafer containment space. The number of ring insert plates can be chosen to adjust the height of the wafer box in accordance with the number of coin-stacked semiconductor wafers to be shipped.
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