发明名称 Plasma processing apparatus
摘要 A plasma processing apparatus includes an evacuatable processing vessel; a workpiece mount base for mounting thereon an object to be processed; a microwave transmitting plate provided in an opening of a ceiling of the processing vessel; a planar antenna member for supplying a microwave into the processing vessel via the microwave transmitting plate; a shield lid grounded to cover a top of the planar antenna member; a waveguide for guiding the microwave to the planar antenna member; a member elevating mechanism for relatively varying a vertical distance between the planar antenna member and the shield lid; a tuning rod insertable into the waveguide; a tuning rod driving mechanism for moving the tuning rod to adjust an insert amount thereof; and a matching control section for controlling an elevation amount of the planar antenna member and the insert amount of the tuning rod to obtain a matching adjustment.
申请公布号 US7226524(B2) 申请公布日期 2007.06.05
申请号 US20040498672 申请日期 2004.06.14
申请人 TOKYO ELECTRON LIMITED 发明人 KASAI SHIGERU;YAMAMOTO NOBUHIKO;ADACHI HIKARU;OSADA YUKI
分类号 C23C16/00;H05H1/46;C23C16/511;C23F1/00;H01J37/32;H01L21/205;H01L21/306;H01P5/103 主分类号 C23C16/00
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