发明名称 |
Placement of sacrificial solder balls underneath the PBGA substrate |
摘要 |
The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away from its mid-plane. Another embodiment of the present invention describes a method and apparatus of arranging the layers of a laminate for use in PBGA packaging that arranges the layers of the laminate according to the stiffness of each layer. Another embodiment of the present invention describes a method and apparatus of packaging a flip chip that uses one or more redundant interconnections at the bottom of the package substrate where the redundant interconnections are within the shadow of the IC chip.
|
申请公布号 |
US7227268(B2) |
申请公布日期 |
2007.06.05 |
申请号 |
US20040977263 |
申请日期 |
2004.10.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHANG CHI SHIH;CHEN WILLIAM T.;TRIVEDI AJIT |
分类号 |
H01L23/48;H01L23/498;H01L23/52;H01L29/40;H05K1/02;H05K3/34 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|