| 摘要 |
A light emitting diode and its fabricating method are provided to improve the reliability of a vertical LED by stably connecting plural light emitting structures using a bonding layer having strong adhesive force. A bonding layer(150) is formed on a conductive substrate(160), and a reflective layer(140) is formed on the bonding layer. A light emitting structure(120) having a first semiconductor layer, an active layer(122) and a second semiconductor is formed on the reflective layer. A passivation layer(130) has a first part(131) covering a sidewall of the light emitting structure and a second part(132) with an aperture(135) exposing the light emitting structure. The reflective layer has the same thickness as that of the second part of the passivation layer.
|
