Sensor for use in electron beam intensity sensing system at food packaging industry, has insulating housing engaged with exit window forming chamber for shielding conductor positioned within chamber

摘要

The sensor has a conductor (26) located within an electron beam path and exposed to an exit window (24), and an insulating housing (28). The insulating housing engaged with the exit window forming a chamber (30) by using a high temperature resistant adhesive, shields the conductor positioned within the chamber which is closed for encapsulating the conductor.