发明名称 |
Method of improving via filling uniformity in isolated and dense via-pattern regions |
摘要 |
An isotropic-diffusion filling method uses a thermal process on a result structure comprising a photoresist layer and an organic material layer to create a cross-linking layer there between, which minimizes step height differences between isolated and dense via-pattern regions for optimizing a subsequent trench process and simplifying process steps.
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申请公布号 |
US7226873(B2) |
申请公布日期 |
2007.06.05 |
申请号 |
US20040992668 |
申请日期 |
2004.11.22 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
YEN YUNG-SUNG;CHEN KUEI-SHUN;LIN CHIA-HSIANG;LIN LAWRENCE;LIN TSUNG HSIEN |
分类号 |
H01L21/31;H01L21/469 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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