| 摘要 |
A method for forming a semiconductor device and an apparatus for forming a semiconductor device using the same are provided to reduce a process time in a track system by exposing a circumferential part of a photoresist layer in an exposure system. A first exposure process is performed to expose a photoresist layer formed on a substrate by using light penetrating a reticle pattern(S110). A second exposure process is performed to expose a circumferential part of the exposed photoresist layer(S120). A developing process is performed to develop the photoresist later exposed by the first and second exposure processes(S130). A method for forming the photoresist layer includes a process for forming an organic anti-reflecting layer on a substrate, a first bake process for baking the substrate, a process for coating the photoresist solution on the organic anti-reflecting layer, and a second bake process for baking the substrate.
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