| 摘要 |
A wafer supporting apparatus is provided to prevent the damage of a guard ring and a wafer by restraining the deflection of the guard ring using an improved connection mechanism composed of a fixing pin of an electrostatic chuck and a groove of the guard ring. A wafer supporting apparatus(100) includes an electrostatic chuck(130) for fixing a wafer and a guard ring. The guard ring(140) encloses the electrostatic chuck in order to protect the electrostatic chuck. The guard ring is fixedly connected to the electrostatic chuck, so that the deflection of the guard ring is prevented. The guard ring is connected with the electrostatic chuck through a groove and a fixing pin corresponding to the groove.
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