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发明名称
Techniques for bonding of an AAM on silicon wafer and fabrication of CNTs field emitter arrays using it
摘要
申请公布号
KR100724927(B1)
申请公布日期
2007.06.04
申请号
KR20050104027
申请日期
2005.11.01
申请人
发明人
分类号
H01J1/304
主分类号
H01J1/304
代理机构
代理人
主权项
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