| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a die bonding material can be prevented from cracking to cause exfoliation of a semiconductor chip from an island. <P>SOLUTION: In a semiconductor device comprising a semiconductor chip, and an island to which the semiconductor chip is die bonded through a die bonding material, the island has a die bonding region to which the semiconductor chip is die bonded, a groove is formed in the outer circumferential part of the die bonding region at least along the outer circumference thereof to pass the vicinity of each corner of the die bonding region, and the die bonding material is interposed between the entire region on the backside of the semiconductor chip and the die bonding region. <P>COPYRIGHT: (C)2007,JPO&INPIT |
