发明名称 Semiconductor device and method of manufacturing the same
摘要 In a semiconductor device and a method of manufacturing the semiconductor device, a plug and a channel structure are formed. The plug fills an opening and the channel structure extends upwardly from the plug. The channel structure has a substantially vertical sidewall. The opening is formed through an insulation structure located on a substrate. The plug and the channel structure comprise a material in a single crystalline state that is changed from an amorphous state by an irradiation of a laser beam. The channel structure is doped with impurities such as boron, phosphorus or arsenic.
申请公布号 US2007123062(A1) 申请公布日期 2007.05.31
申请号 US20060605092 申请日期 2006.11.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG SUNG-KWAN;LEE JONG-WOOK;SON YONG-HOON;SHIN YU-GYUN;LEE JUN-HO
分类号 H01L21/336;H01L21/00;H01L29/76 主分类号 H01L21/336
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