MEMS DEVICE AND INTERCONNECTS FOR SAME

摘要

A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode (16) and a movable layer (14) within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode (14) and a mechanical layer (92) of the device. In an embodiment, this conductive layer is a sacrificial layer (60) that is subsequently removed to form a cavity (19) between the electrode (16) and the movable layer (14). The sacrificial layer (60) is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer (14) that preferably comprises aluminum.