METHOD FOR FORMING METALLIC FILM AND METAL PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a metallic film which has superior adhesiveness to a substrate, sufficient electroconductivity and small unevenness in the interface with the substrate, by a simple method, and to provide a method for forming a fine metal-pattern which has superior adhesiveness to the substrate, sufficient electroconductivity and small unevenness in an interface with the substrate without carrying out an etching step, by a simple method.

SOLUTION: The method for forming the metallic film comprises the steps of: (a1) arranging a polymer layer made from a polymer which has a functional group interacting with a metallic ion or a metal salt and directly chemically bonds to a substrate, on the substrate; (a2) imparting the metallic ion or the metal salt to the polymer layer; (a3) reducing the metallic ion or the metal salt to form an electroconductive layer with surface resistivity of 10 to 100 kΩ/SQUARE; and (a4) forming an electroconductive layer with surface resistivity of 1×10-1Ω/SQUARE or less by electroplating.

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