发明名称 CURABLE SILICONE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable silicone composition capable of suppressing the marked elevation of viscosity of the obtained composition even if the composition contains a resinous organopolysiloxane for molding a silicone cured material having suitable hardness and strength, and excellent in flowing property and filling property. SOLUTION: This curable silicone composition consists at least of (A) a diorganopolysiloxane having at least 2 alkenyl groups in one molecule, (B) at least 2 kinds of resinous organopolysiloxanes consisting of SiO<SB>4/2</SB>unit, R<SP>1</SP><SB>2</SB>R<SP>2</SP>SiO<SB>1/2</SB>unit and R<SP>1</SP><SB>3</SB>SiO<SB>1/2</SB>unit [wherein, R<SP>1</SP>is a substituted or non-substituted monovalent hydrocarbon group without containing an aliphatic unsaturated bond: and R<SP>2</SP>is an alkenyl] and having different mass-average molecular weights measured by gel permeation chromatography based on a standard polystyrene, (C) an organopolysiloxane having at least 2 hydrogen atoms bonded with silicon atom in one molecule and (D) a hydrosililation reaction catalyst. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007131694(A) 申请公布日期 2007.05.31
申请号 JP20050324510 申请日期 2005.11.09
申请人 DOW CORNING TORAY CO LTD 发明人 YAMAMOTO SHINICHI;KATO TOMOKO;ENAMI HIROSHI;MORITA YOSHIJI
分类号 C08L83/06;C08L83/07 主分类号 C08L83/06
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