| 摘要 |
In a submount main body ( 1 ) composed of a single crystal silicon, a mounting surface ( 4 ) on which a light-emitting device ( 11 ) is mounted is composed of a ( 100 )-oriented surface and the inner surface of a through hole ( 3 ) which is formed by anisotropic etching is parallel to the ( 110 )-oriented surface. The light-emitting portion of the light-emitting device ( 11 ) is arranged to face a device-side opening ( 31 ) which opens into the mounting surface ( 4 ) of the submount main body ( 1 ). Consequently, heat generated in the light-emitting device ( 11 ) can be discharged to the outside more efficiently than the case where the light-emitting portion is arranged to face a side opposite to the submount side. Specifically, light from the light-emitting device ( 11 ) is reflected by a reflective surface formed on the surface of the through hole ( 3 ), and highly efficiently transmitted outside of the submount main body ( 1 ).
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