发明名称 METHOD FOR MANUFACTURING SUBSTRATE HAVING THIN FILM PATTERN LAYER
摘要 A method for manufacturing a substrate ( 10 ) having a thin film pattern layer ( 114 ) thereon includes the steps of: providing a preformed substrate ( 11 ) including a number of partition walls with ink repellent characteristic ( 104 ) and receiving spaces ( 106 ) bounded by the corresponding partition walls; filling the receiving spaces with an ink ( 112 ) containing a solidifiable content, wherein the ink received in each of the receiving spaces has a volume greater than that of the corresponding receiving space; and solidifying the ink so that the solidifiable content in the ink is formed into the thin film pattern layer in the receiving space.
申请公布号 US2007120931(A1) 申请公布日期 2007.05.31
申请号 US20060561348 申请日期 2006.11.17
申请人 ICF TECHNOLOGY CO., LTD. 发明人 WANG YU-NING;HSU YEN-HUEY;CHOU CHING-YU
分类号 B41J2/01 主分类号 B41J2/01
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