发明名称 Electronic component manufacturing method and electronic component
摘要 The electronic component includes a base material, a capacitor unit, and a wiring portion. The capacitor unit has a stacked structure including a first electrode portion provided on the base material, a second electrode portion including a first surface opposing the first electrode portion and a second surface opposite to the first surface, and a dielectric portion interposed between the electrode portions. The wiring portion includes a via portion having a surface on the base material side, and joined to the second surface of the second electrode portion via the surface on the base material side. The surface of the via portion on the base material side includes an extending portion extending outward of the periphery of the second surface of the second electrode portion.
申请公布号 US2007122992(A1) 申请公布日期 2007.05.31
申请号 US20060595913 申请日期 2006.11.13
申请人 FUJITSU LIMITED 发明人 MIZUNO YOSHIHIRO;MI XIAOYU;MATSUMOTO TSUYOSHI;OKUDA HISAO;UEDA SATOSHI
分类号 H01L27/108;H01L21/20 主分类号 H01L27/108
代理机构 代理人
主权项
地址