| 摘要 |
THE PRESENT INVENTION RELATES TO AN ARRANGEMENT FOR COOLING ELECTRONIC EQUIPMENT IN A SPACE BY MEANS OF RADIATION TRANSFER, WHEREIN THE EQUIPMENT INCLUDES HEAT-EMITTING ELECTRONIC COMPONENTS MOUNTED ON A CIRCUIT BOARD OR THE LIKE. ACCORDING TO THE INVENTION, EACH CIRCUIT BOARD (1) OR THE LIKE IS SURROUNDED BY A COLD PLATE (3) WHICH IS SPACED FROM THE CIRCUIT BOARD. THE SURFACES OF BOTH THE CIRCUIT BOARD (1) AND THE PLATE (3) ARE TREATED SO AS TO HAVE A HIGH IR-RADIATION COEFFICIENT, WHEREIN HEAT IS TRANSFERRED FROM THE HOT CIRCUIT BOARD TO THE RELATIVELY COLDER PLATE BY RADIATION.(FIG 1)
|
