| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate incorporated in an electronic component to be further thinned, where the electronic component is embedded, and to provide its manufacturing method. <P>SOLUTION: The substrate incorporated in the electronic component comprises an insulating resin substrate 17; first wiring 19a formed on one surface of the insulating resin substrate 17; and the electronic component 13 where an electronic circuit is incorporated, bumps 14 are formed so as to be connected to the electronic circuit, and the bumps 14 are embedded in the insulating resin substrate 17 so as to be connected to the first wiring 19a. <P>COPYRIGHT: (C)2007,JPO&INPIT |
