| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving wire cost reduction, and having an excellent bonding state and improved loop-shape retaining force. <P>SOLUTION: The semiconductor device 10 is composed by connecting a wire 13 to a lead frame 11 with a primary bond (A), and connecting the wire 13 to a bond pad 16 of a semiconductor element 12 with a secondary bond (B) while forming a loop (R). In this case, a copper or copper-alloy wire is adopted as the wire 13. A gold or gold-alloy bump 17 is formed in the bond pad 16 of the semiconductor element 12. <P>COPYRIGHT: (C)2007,JPO&INPIT |
