| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a break of a piezoelectric wafer by plasma etching. <P>SOLUTION: A manufacturing method of a piezoelectric vibrating piece with an etching process in which plasma etching is performed to crystal wafer through a metal mask with a predetermined pattern formed on a surface of the crystal (piezoelectric) wafer, has, before the etching process, a process of forming a metal film 30 with penetration grooves 28 which are narrower than grooves formed in a piezoelectric vibrating piece forming area 18 and by which a micro loading effect can be obtained in a wafer peripheral portion 20 outside of the piezoelectric vibrating piece forming area of a crystal wafer 10. <P>COPYRIGHT: (C)2007,JPO&INPIT |
