| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive solder resist composition having high sensitivity and small surface tackiness in a blue-violet laser exposure system, excellent in strippability, adhesion to a substrate and storage stability, and providing a cured film having excellent insulation, heat resistance, chemical resistances and surface hardness after development and also provide a photosensitive solder resist film obtained by using the composition, a high-definition permanent pattern, and a method of efficiently forming the pattern. <P>SOLUTION: The photosensitive solder resist composition contains an alkali-soluble photocrosslinkable resin, a polymerizable compound, a photopolymerization initiator, a heat crosslinking agent, a heat curing accelerator and a colorant, wherein the photosensitive solder resist composition contains a (meth)acrylamide copolymer having an acid number of 90-200 mgKOH/g and a mass average molecular weight of 30.000-80,000 (other than a (meth)acrylamide copolymer having a self-condensing group as a substituent) in an amount of 10-50 mass% based on the amount of the alkali-soluble photocrosslinkable resin. The photosensitive film obtained by using the composition, the permanent pattern and the method for forming the pattern are also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
