| 摘要 |
PROBLEM TO BE SOLVED: To obtain a heat sink structure high in heat transmission speed by replacing a bottom plate into a material having a bigger thermal conductance. SOLUTION: This heat sink structure comprises a central thermal conductor 22, a plurality of cooling fins 23 extending from a periphery of the central thermal conductor 22, a via hole penetrating both sides of the central thermal conductor 22, and a cover plate 24 and bottom plate 27 which form the heat sink 21 in which a cooling liquid is filled by blockading both apertures of the via hole. Quicker and excellent thermal absorption and heat transmission effect can be obtained by making the bottom plate 27 replaceable by the material having the bigger thermal conductance than that of the heat sink 21. COPYRIGHT: (C)2007,JPO&INPIT |
