| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board capable of inexpensively manufacturing a multilayer printed wiring board excellent in connection reliability with a simplified process, and also to provide a multilayer printed wiring board manufactured by the manufacturing method excellent in connection reliability. SOLUTION: The wiring board base member has a conductor comprising an insulating substrate, a conductive layer provided on at least one surface of the insulating substrate, and a conductive part obtained by filling a conductive paste composition A in a hole penetrating the insulating substrate and the conductive layer. The method of manufacturing the multilayer printed wiring board includes a process: of laminating and pressing at least three layers of the wiring board base member a having bumps each having a larger diameter than that of the foregoing conductive part, and formed thereon; of an adhesive sheet through which a through-hole having a larger diameter than the bump is formed; and of another wiring board base member b. COPYRIGHT: (C)2007,JPO&INPIT |
