| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device that forcibly cools a high caloric intensity-semiconductor laser element, a semiconductor laser light source device, and a semiconductor laser light source unit provided with the cooling device, a method for manufacturing the semiconductor laser light source unit, and a solid laser device. SOLUTION: The system is provided with: a first planar member formed of a metal to which a cooled body is bonded along a predetermined end; a second planar member formed of metals where an inlet opening that introduces a cooling liquid, a cooling liquid introducing groove that is connected to the inlet opening and is provided so as to reach one end of a region corresponding to the end and an outlet opening that discharges the cooling liquid, and a cooling liquid discharging groove that is connected to the outlet opening and is provided so as to reach the other end of the region corresponding to the end are each formed; and a third planar member formed of a metal where at least one cooling groove or more that are formed along the region corresponding to the end while communicated with the cooling liquid introducing groove and the cooling liquid discharging groove to allow the cooling liquid to flow in the longitudinal direction of the cooled body, are provided. COPYRIGHT: (C)2007,JPO&INPIT
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