| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of suppressing rising of a chip while avoiding the occurrence of an explosion phenomenon in mounting. SOLUTION: In the electronic component 1, a concave portion 7 is formed on the substantial center portion of an end face of a terminal electrode 3, the formation width W1 of the concave portion 7 is 30% or more of a chip width W2. The formation of the concave portion 7 causes a solder fillet S to hardly come up in a height direction of the terminal electrode 3 when the electronic component 1 is mounted on a circuit board 12. In this way, in the electronic component 1, a tensile stress applied on the end of the electronic component 1 from the solder fillet S in mounting can be relaxed and the generation of the rising of the chip can be efficiently suppressed. Further, in the electronic component 1, the maximum depth D of the concave portion 7 is 0.7%-3.7% of a chip height H. As a result, a blank 2 is hardly exposed from the end surface of the terminal electrode 3. Accordingly, the occurrence of the explosion phenomenon in mounting the electronic component 1 can be almost positively avoided. COPYRIGHT: (C)2007,JPO&INPIT
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