| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor package having high degrees of freedom of mounting to a circuit board or the like. SOLUTION: A ceramic package 110 for an acceleration sensor comprises a silicon chip, whose acceleration detection element is formed of MEMS (Micro Electro-Mechanical Systems), and a ceramic package 110 for storing the silicon chip. The ceramic package 110 has a hexahedron structure and lead terminals 121-128 are formed at the bottom face 112 thereof. Lead terminals 131-138 are formed on a side face 114, orthogonal to the bottom face 112. The lead terminals 121-128 are overlaid on the lead terminals 131-138, one of the bottom face 112 and the side face 114 is selected, and the acceleration sensor is mounted to the circuit board. COPYRIGHT: (C)2007,JPO&INPIT
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