发明名称 SEMICONDUCTOR DEVICE AND ITS PROCESS FOR FABRICATION
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the VF of a diode does not increase, in which a recovery current is also be made low, and which includes an IGBT and a diode. <P>SOLUTION: The semiconductor device includes: a first conductive semiconductor substrate; a first conductive semiconductor layer formed in the primary main surface side of a semiconductor substrate; a second conductive base layer formed in the primary main surface side of the semiconductor layer and isolated by the semiconductor layer between the semiconductor substrates; one pair of trenches formed so that it penetrates the base layer from the primary principal plane and reaches at least the semiconductor layer; an insulating film provided in the interior of the trench; a gate electrode formed in the trench through an insulating layer; a first conductive semiconductor layer and a second conductive semiconductor layer formed in the second main surface side of the semiconductor substrate; and an emitter region provided in the first main surface side of the base layer along with the trench. The semiconductor device also has: a transistor for controlling the current flowing through the base layer; and a diode. The emitter region is provided only in the region inserted into one pair of the trenches. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007134625(A) 申请公布日期 2007.05.31
申请号 JP20050328541 申请日期 2005.11.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAHASHI HIDEKI
分类号 H01L29/739;H01L21/336;H01L21/8234;H01L27/04;H01L27/06;H01L29/78;H01L29/861 主分类号 H01L29/739
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