| 摘要 |
PROBLEM TO BE SOLVED: To prevent chipping when two or more semiconductor chips held on the wafer sheet are separated from each other, after dicing from the wafer which is stuck to the wafer sheet. SOLUTION: An expanding device elongates a wafer sheet 1 so as to extend the spacing between semiconductor chips 4. The device is constituted of: an expanding ring 6 for supporting the wafer sheet 1; a wafer ring control 7 for expanding the wafer sheet 1 on the expanding ring 6; and an extension maintenance ring 11 for holding the extension of the wafer sheet 1 attached in the region outside the wafer of the wafer sheet 1 which is elongated on the expanding ring 6. In the state where the extension of the wafer sheet 1 is held optimally, it is removed from the expanding ring 6 and installed again. Accordingly, the load to the wafer sheet 1 caused by repeated expanding in the case of rank classification production etc. is reduced to the minimum, and chipping between adjoining chips which is derived from the slack of the wafer sheet 1 is also prevented. COPYRIGHT: (C)2007,JPO&INPIT |
