| 摘要 |
PROBLEM TO BE SOLVED: To obtain an accurately-positioned semiconductor unit that has no inclination or warpage to a support while being accurately adhered onto a face of the support as a reference in parallel, when adhering and fixing an image pickup element as a semiconductor element to the support. SOLUTION: The semiconductor unit is formed of the semiconductor element 20 and the support 10 to which the semiconductor element 20 is fixed by adhesion. The semiconductor element 20 is formed so that a recess 21 is formed on a face at the side adhered to the support 10, and the recess 21 is formed so as to communicate with an outside space while being extended to the outer edge of the semiconductor element 20. COPYRIGHT: (C)2007,JPO&INPIT
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