| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor containing a trace amount of a bromine-based flame retardant, an antimony compound or none of them, which is excellent in moldability, reliability, and flame resistance; and a semiconductor device using the same. SOLUTION: This epoxy resin composition for sealing a semiconductor comprises as essential components: (A) an epoxy resin having an ICI viscosity at 150°C of 1 poise or less; (B) a curing agent having a hydroxyl equivalent of 140 or more; (C) a curing accelerator; and (D) an inorganic filler, wherein the amount of the filler is 87 to 95% by weight and each of the amounts of bromine and an antimony compound is 0.01% by weight or less, based on the total weight of the composition, and the semiconductor device is produced using the epoxy resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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