发明名称 |
Processing liquid coating apparatus and a processing liquid coating method |
摘要 |
The present invention relates to a processing liquid coating apparatus and a processing liquid coating method suitable for use in a lithography process for forming fine circuit patterns on a surface of a substrate such as a semiconductor wafer. The processing liquid coating apparatus according to the present invention includes a substrate holder ( 1 ) for holing and rotating a substrate (W), and a processing liquid supply unit ( 2 ) disposed apart from the substrate (w) held by the substrate holder ( 1 ). The processing liquid supply unit ( 2 ) has a plurality of supply ports ( 5, 6 ) for supplying a processing liquid to a plurality of portions including a central portion (C) of a surface of the substrate (W). A resist liquid or a developer is used as the processing liquid.
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申请公布号 |
US2007122559(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
US20040573915 |
申请日期 |
2004.10.27 |
申请人 |
SHIRAKASHI MITSUHIKO;HIROSE MASAYOSHI |
发明人 |
SHIRAKASHI MITSUHIKO;HIROSE MASAYOSHI |
分类号 |
G21H5/00;B01J19/08;B05C11/00;B05C11/08;B05D1/40;G03F7/16;G03F7/30;G21H1/00;H01F41/00;H01L21/00;H01L21/027;H01L21/687 |
主分类号 |
G21H5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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