发明名称 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
摘要 A separable connection is created between at least one transfer support and the conductor structure. The transfer support including the conductor structure and the substrate are joined together such that a connection that is stronger than the separable connection between the transfer support and the conductor structure is created between the conductor structure and the substrate. The separable connection between the transfer support and the conductor structure of the transfer support is separated while the connection between the conductor structure and the substrate remains intact. The method is particularly suitable for laterally disposing conductor structures comprising nanotubes at relatively low temperatures (T<600� C.), resulting in a substrate with a conductor structure which is connected to the substrate on a contact surface of the substrate and at least one additional contact surface of the substrate. In the device, a conductor structure provided with nanotubes extends between the two contact surface of the substrate, said nanotubes being oriented from a first contact surface of the substrate to a second contact surface of the substrate. The nanotubes are arranged laterally such that nanowires are created, allowing the excellent electrical and thermal properties of the nanotubes to be utilized.
申请公布号 US2007120273(A1) 申请公布日期 2007.05.31
申请号 US20050587982 申请日期 2005.01.26
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 ECKSTEIN GERALD;WERSING WOLFRAM
分类号 B32B9/00;B81B7/00;C01B31/02;H01L21/48;H01L21/68;H01L21/768;H01L23/498;H05K1/03;H05K3/20 主分类号 B32B9/00
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