发明名称 BACK PLATE ASSEMBLY FOR MOUNTING A HEAT SINK ASSEMBLY TO A MOTHERBOARD
摘要 A back plate assembly for a motherboard includes a back plate, four posts and four plastic rings. The back plate abuts against an underside of the motherboard. The posts extend from the back plate and pass through the motherboard. The rings engage with the posts respectively and elastically abut against an upside of the motherboard.
申请公布号 US2007121300(A1) 申请公布日期 2007.05.31
申请号 US20050164535 申请日期 2005.11.29
申请人 XIA WAN-LIN;LI TAO;ZHANG JUN;QIN JI-YUN 发明人 XIA WAN-LIN;LI TAO;ZHANG JUN;QIN JI-YUN
分类号 H05K7/20 主分类号 H05K7/20
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