发明名称 |
BACK PLATE ASSEMBLY FOR MOUNTING A HEAT SINK ASSEMBLY TO A MOTHERBOARD |
摘要 |
A back plate assembly for a motherboard includes a back plate, four posts and four plastic rings. The back plate abuts against an underside of the motherboard. The posts extend from the back plate and pass through the motherboard. The rings engage with the posts respectively and elastically abut against an upside of the motherboard.
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申请公布号 |
US2007121300(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
US20050164535 |
申请日期 |
2005.11.29 |
申请人 |
XIA WAN-LIN;LI TAO;ZHANG JUN;QIN JI-YUN |
发明人 |
XIA WAN-LIN;LI TAO;ZHANG JUN;QIN JI-YUN |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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