SEMICONDUCTOR DIE PACKAGE USING LEADFRAME AND CLIP AND METHOD OF MANUFACTURING
摘要
A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip structure can be used in a MLP (micro-leadframe package).
申请公布号
WO2007061558(A2)
申请公布日期
2007.05.31
申请号
WO2006US41543
申请日期
2006.10.24
申请人
FAIRCHILD SEMICONDUCTOR CORPORATION;CRUZ, ERWIN VICTOR R.;CABAHUG, ELSIE;SHIAN, TI CHING;IYER, VENKAT
发明人
CRUZ, ERWIN VICTOR R.;CABAHUG, ELSIE;SHIAN, TI CHING;IYER, VENKAT