| 摘要 |
A heat sink module used in a notebook computer is provided, in which a heat sink fin set is fixed in a fan case and an upper case is disposed on fan leaves within the fan case, the upper cover has a hole disposed at a region over the fan leaves. A heat conducting tube has two ends, with one disposed on the heat sink fin set and the other fixed with a side plate. Then, the thermally conducting piece is fixed on the upper case. Finally, a press and fixation member is disposed on the side plate and assembly of the heat sink module is completed. In case of being used, the thermally conducting piece is bonded on the heat source. As such, not only heat may be moved from the heat source but also the heat sink module has increased strength and reduced weight. |
