METHOD OF COPPER PLATING.

摘要

A METHOD OF COPPER-PLATING A MATERIAL WHEREBY ELECTROLYSIS IS PERFORMED USING AN ELECTROLYTIC PLATING CELL INCLUDING A DIAPHRAGM (7) WHICH SEPARATES AN ANODE CHAMBER HAVING THEREIN AN INSOLUBLE METAL ELECTRODE (5) AS AN ANODE FROM A CATHODE CHAMBER HAVING THEREIN THE MATERIAL (2) TO BE PLATED AS A CATHODE, AND FURTHER USING AN ELECTROLYTE SOLUTION CONTAINING COPPER IONS AND ADDITIVE , WHEREIN THE ELECTROLYTE IS FED TO THE CATHODE CHAMBER IN A MANNER SUCH THAT THE COPPER ION CONCENTRATION IN THE ELECTROLYTE WITHIN THE CATHODE CHAMBER IS KEPT CONSTANT AND ELECTROLYTE IS FURTHER FED TO THE ANODE CHAMBER AT A RATE OF FROM ABOUT 0.2 TO 11 MI/KAH.(FIG. 1)