| 摘要 |
A component arrangement has a semiconductor body, a dielectric layer and a planar transformer. The semiconductor body includes a face. The planar transformer includes a primary winding, a first planar winding section, and a second planar winding section, each vertically spaced apart from each other. The first planar winding section forms at least a part of the secondary winding and has a first connection forming a first connection of the secondary winding. The dielectric layer is positioned on the face and isolates the primary winding from the first planar winding section. The second planar winding section is disposed between the first planar winding section and the primary winding.
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