| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring circuit board ensuring reliability of mounting and enabling loading of semiconductor chips with fine connecting pitches, and also to provide a semiconductor device ensuring reliability of mounting and loading semiconductor chips to the wiring circuit board with fine connecting pitches. <P>SOLUTION: A manufacturing method of a wiring circuit board for mounting semiconductor chips including connecting points connected to semiconductor chips and pattern wires connected to the semiconductor chips via connecting points. The method comprises a power feeding layer forming step to form a power feeding layer in view of forming connecting points with an electrolytic plating method, a masking step to form a mask pattern on the power feeding layer, an etching step for etching the power feeding layer exposed from the mask pattern, and an electrolytic plating step to form the connecting points with the electrolytic plating method on the pattern wires exposed from the mask pattern. <P>COPYRIGHT: (C)2007,JPO&INPIT |
