| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card or a thermobonding polyester film for an IC tag each showing improved thermobonding, unevenness absorbency and slidability while maintaining environmetal adaptability as a plastic material for the IC card or the IC tag (containing no halogen), heat resistance and chemical resistance. <P>SOLUTION: The thermobonding polyester film for the IC card or the IC tag each obtained by making a thermobonding layer overlie a biaxially stretched polyester film is characterized in that the thermobonding layer is 5 to 30 μm thick, and is composed of a mixture of an amorphous polyester resin A having Tg of 50 to 95°C and a thermoplastic resin B having Tg of -50 to 150°C incompatible with the amorphous polyester resin A, the content of the thermoplastic resin B in the thermobonding layer being 1 to 30 mass%, in that a static friction coefficient between the front and back surfaces of the thermobonding polyester film is 0.1 to 0.8, and in that a forming rate by heat press is 40 to 105% and a slope of the outer margin of the formed part is 20 to 1,000%. <P>COPYRIGHT: (C)2007,JPO&INPIT |
