| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of which the underfill resin is simultaneously and stably packed on the lower surface side of a plurality of semiconductor elements arranged to adjoin each other. SOLUTION: A plurality of semiconductor elements 2 and 3 are mounted in face-down manner on a circuit board 1 through bumps 4 and 5. An underfill resin 6 is packed in the gap between the lower surfaces of the semiconductor elements 2 and 3 and the upper surface of the circuit board 1. The plurality of semiconductor elements 2 and 3 are arranged to adjoin each other on the circuit board 1. A projection 9 which encourages flowing of the underfill resin 6 into the gap between the lower surfaces of the semiconductor elements 2 and 3 and the upper surface of the circuit board 1 is arranged on the circuit board 1 in the middle of the adjoining semiconductor elements 2 and 3. COPYRIGHT: (C)2007,JPO&INPIT
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