| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of thin, light, soft, strong, and flexible printed circuit boards for mass production with no adhesive. SOLUTION: The manufacturing method of a printed circuit board includes a process to form a gap (g) by stacking a conductive thin plate (2) on a transfer substrate (20) having embosses (20a), a process for efficiently forming an insulating substrate (1) on the conductive thin plate (2) by vapor deposition polymerization, a process for forming a specified circuit pattern (3) on the insulating substrate (1), and a process for forming an insulating layer of organic polymer material on the circuit pattern (3) as a cover sheet (4) by the vapor deposition polymerization. The printed circuit board is further thin and strong than a conventional printed circuit board. It is manufactured easily and hard to peel as no adhesive is used. Both the insulating substrate and the cover sheet can be manufactured using the same organic polymer material. The mass productivity of an intermediate product in which the insulating substrate is polymerized by vapor deposition with the conductive material is good. COPYRIGHT: (C)2007,JPO&INPIT
|
