| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which facilitates setting of magazines, while improving the number of loading magazines. SOLUTION: In a supply process, a magazine 71 of a loader unit 61 is taken out by an upper hand 112, a lead frame is moved to a pass line, and it is pushed out to a bonding unit. The magazine 71 which finishes the supply of all the lead frames is moved to a buffer unit 62. In a collection process, the magazine 71 of the buffer unit 62 is taken out by a lower hand 113, a lead frame accommodation is moved to a pass line 32, and the lead frame after bonding is accommodated in the lead frame accommodation. When lead frames are collected to all the lead frame accommodations, the magazine 71 is moved to an unloader unit 63, and the magazine 71 of the buffer unit 62 is used as an object for collection of a lead frame. COPYRIGHT: (C)2007,JPO&INPIT
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