| 摘要 |
PROBLEM TO BE SOLVED: To provide a module package wherein the area of a printed board is reduced, and terminals having a large area is formed on the side face. SOLUTION: The module package 10 comprises: a first substrate 11; a second substrate 13 whereon an IC 17 is mounted and a wiring pattern 16 for connecting the IC 17 and lands 15 is formed; and an insulator composite sheet 12 formed with vias 14 for electrically connecting the two substrates. The vias 14 and the lands 15 are arranged on the boundary lines along which the substrates are cut during a manufacturing process of the package. Accordingly, parts of them are cut together with the substrates and are exposed on the side face of the package 10, resulting in forming the terminals having a large area on the side face of the module package. COPYRIGHT: (C)2007,JPO&INPIT
|
