| 摘要 |
PROBLEM TO BE SOLVED: To provide an element breaking-off device capable of accurately breaking off a plurality of piezoelectric elements supported by a wafer from the wafer at the same time. SOLUTION: The element breaking-off device includes: a breaking-off means 50 that includes a plurality of breaking-off pins 52 opposed to the piezoelectric elements supported by the wafer 20 and allows the pins 52 to be relatively advanced to and retreated from the piezoelectric elements so as to break off the piezoelectric elements from the wafer 20; and an element positioning tool 70 for using an accommodation unit 72 corresponding to an outward form of the wafer 20 to position the wafer 20 and including throughholes 74 each corresponding to each of the piezoelectric elements at an inner bottom of the accommodation unit 72. COPYRIGHT: (C)2007,JPO&INPIT
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