发明名称 |
Flexible ring interconnection system |
摘要 |
Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
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申请公布号 |
US2007123067(A1) |
申请公布日期 |
2007.05.31 |
申请号 |
US20070657995 |
申请日期 |
2007.01.25 |
申请人 |
NODA ATSUHITO;ICHIJO YASUHIRO;HOSHIKAWA SHIGEYUKI |
发明人 |
NODA ATSUHITO;ICHIJO YASUHIRO;HOSHIKAWA SHIGEYUKI |
分类号 |
H01R12/00;H01R4/02;H01R13/24;H05K3/30;H05K3/34 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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