| 摘要 |
A semiconductor device comprises at least one first electrode 11 b provided on the front surface of a semiconductor chip and electrically connected to at least one of electrodes that constitute a transistor, a second electrode 9 provided on the back surface of the semiconductor chip and electrically connected to one of the other electrodes, a via hole penetrating the semiconductor chip from the front surface to the back surface, and a through electrode 11 a a part of which is exposed on the front surface of the semiconductor chip electrically connected to the second electrode 9 through the via hole.
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