| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attach paste for semiconductor with low elastic modulus and excellent adhesion and to provide a semiconductor excellent in reliability such as reflow resistance, etc. SOLUTION: The resin composition comprises (A) a (meth)acrylate having a carboxyl group, (B) a compound liquid in room temperature comprising at least one selected from following (B1)-(B4), (C) a heat radical polymerization initiator and (D) a filler. Wherein, (B1) is a urethane compound having a (meth)acryloyl group and an aliphatic ring, (B2) is a polymer or a copolymer of a diene compound having a (meth)acryloyl group, (B3) is a polyester compound having a (meth)acryloyl group and an aliphatic ring, and (B4) is a polycarbonate compound having a (meth)acryloyl group. COPYRIGHT: (C)2007,JPO&INPIT |
